With the increasing requirement of trouble free performance of electronic products, the service life of connector is the primary index to measure the performance and reliability of connector. At the same time, with the increasing market competition, finding suitable materials in non expensive alloys has become the first choice for engineers to reduce the cost of connectors. In many cases, the combined results of these trends make the working characteristics of copper alloy of connector more close to its performance limit. The initial contact force is an important factor in connector design and material properties. In the contact, the elastic deformation will be converted into plastic deformation, so the stress release will lead to the decrease of contact force. If the contact force is lower than a critical level, the contact will fail. Therefore, the prediction of stress release as a function of time and temperature is a key factor to ensure the reliability of connectors. Next, Haolong Electronics will introduce in detail the problems related to stress release test and prediction of connector service life. Stress release data is an effective tool for designers to predict the service life of electronic connectors, and make them make decisions on the choice of contact materials according to the existing data. These data are now widely used in the computer, communication and automotive electronics industries. At present, the life cycle data of products are very scarce, especially in the field of computer. Moreover, it is a more useful data to shorten the product development cycle and validity period. Most connector designers use stress release data to narrow the selection range of contact materials according to application requirements. However, many designers are also looking for appropriate test methods to more accurately predict the characteristics of connector service life. This can greatly reduce the number of samples required for the test and the related cost of testing many samples. At present, most of the automotive connectors in harsh environment and engine hood adopt level 3 or level 1 design technical requirements, while the working temperature of the next generation automotive connector is expected to increase to. However, most non automotive connectors do not seem to need to maintain their stability under the above conditions. However, high density connectors require a low initial insertion force, which in turn reduces stress release. This makes stress release an important feature even at lower temperatures. The standard determination time required for test data related to a specific application is generally difficult to determine accurately. Under the expected operating temperature, the test time between 1000h and 3000h can be used to evaluate the characteristic data of automotive electronic products. There are various signs that people have paid more and more attention to the characteristic data beyond 3000h, namely 3000-5000h (equivalent to 150000 mile service life). The calculation of test data (without considering the change of slope) may lead to overestimation of contact life, and its high estimation will increase with time. At present, the semi logarithm graph representation of data at a certain temperature is the most widely used, and it needs the most urgent. This is also the easiest way to compare materials for a particular application. It should be emphasized, however, that the extrapolated data should be carefully examined and that attention should be paid to the possibility of an eventual over estimation of life. In the stress release test, the following conclusions are drawn: 1. The factors that make the working performance of the connector more close to the alloy performance limit may continue to exist. It shows that the key of connector design is to predict the stress release accurately. 2. When the stress is a correlation function of test time, it is often found that the slope changes. Therefore, the test time should be longer to obtain this feature. 3. When there is a certain correlation between the measured data and the temperature, it is very useful to extend the existing data linearity to a longer test time. In addition, when the test time exceeds the specification, there will be inclination turning sometimes, and its performance cannot be predicted at other temperatures. 4. In a single diagram, Larsen Miller parameter is very useful when drawing data curves under various temperatures. This method is also very useful for predicting the properties of materials between the two temperatures of completed and expected short-term tests, and for simulating the long-term properties of materials. However, if the test temperature range is exceeded, it cannot be used to calculate. 5. The two methods can be combined to recheck the calculated value. 6. The rolling of copper strip can simulate the manufacturing of connector, and its effect is opposite to that of c7025 and c17410. 7. There are some limitations in the data obtained from the strip. Since the bending is completed in the connector manufacturing process, it does not reflect any negative effects.